半導體製造概論
Introduction to Semiconductor Manufacturing

English ｜ 繁體中文 ｜ 简体中文 ｜ 日本語 ｜ 한국어

An open, beginner-friendly book that follows one silicon wafer from sand, through the fab, test and packaging, until it becomes a chip. It skips heavy physics and focuses on process flow, terminology and know-how from the fab floor, with term boxes and know-how boxes in every chapter. No background in semiconductor physics is needed.

• Found a mistake? Open an issue with the "Erratum" template.
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The original text is written in Traditional Chinese, and the other languages are translations of it. If this book helps you, please give it a ⭐ star so that more people can find it.

This book is based on public information and general industry knowledge. It contains no confidential information, process parameters or internal procedures of any company, and it is not affiliated with any semiconductor company. Most numbers are orders of magnitude or approximate values; actual values vary by process, product and company.

The text and images are licensed under CC BY-NC-SA 4.0. You may share, adapt and translate them for non-commercial purposes, as long as you give credit and share your work under the same license.